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Vespel ASB-5740 PI DuPont 杜邦
- 品牌：DuPont 杜邦
- 價格： ￥13.7/千克
- 發(fā)布日期： 2024-08-09
- 更新日期： 2025-07-15
產品詳請
| 品牌 | DuPont 杜邦 |
| 貨號 | |
| 用途 | Vespel? ASB 組件包括將復合材料或碳石墨緊固/粘合到支撐金屬結構上,或將一種材料與另一種材料(如熱塑性塑料)包覆成型/嵌件成型。 這種集成能力為幫助解決挑戰(zhàn)提供了更多的可能性。 |
| 牌號 | Vespel ASB-5740 |
| 型號 | Vespel ASB-5740 |
| 品名 | 聚酰亞胺類 |
| 包裝規(guī)格 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 外形尺寸 | 板、棒、管、方塊、長條、圓盤、環(huán)、圓球和定制機加工制件 |
| 生產企業(yè) | DuPont 杜邦 |
| 是否進口 |
Vespel 是杜邦公司生產的一系列耐用高性能聚酰亞胺基塑料的商標。
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術。它結合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產生明顯的釋氣,這使得它可用于輕質隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結合是 Vespel 的主要優(yōu)勢。
熱物理性質
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產,DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質,而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質。
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.58
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經過驗證的強度、耐磨性和低摩擦。
發(fā)動機部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
半導體制造后端
尺寸穩(wěn)定的杜邦™ Vespel® 部件是晶圓處理和芯片測試的理想選擇 - 它們磨損低,不會損壞金屬或陶瓷等晶圓。
飛機發(fā)動機短艙設計
杜邦™ Vespel® 具有久經考驗的剪切強度、抗沖擊性和減輕重量,可提高飛機發(fā)動機短艙的性能。
Vespel® 發(fā)動機機油系統(tǒng)密封件
杜邦™ Kalrez® O 形圈、墊圈和定制密封件可承受噴氣燃料、發(fā)動機潤滑油、液壓油、火箭推進劑和氧化劑的侵蝕。
動力運動車輛
杜邦™ Vespel® 離合器組件具有韌性、高摩擦下的低磨損和抗沖擊性,使其成為全地形車、摩托車等的理想選擇。
飛機發(fā)動機短艙設計
杜邦™ Vespel® 具有久經考驗的剪切強度、抗沖擊性、輕量化和高耐熱性,可提高飛機發(fā)動機短艙性能。
傳動系統(tǒng)組件
特點和應用
Vespel 主要用于航空航天、半導體和運輸技術。它結合了耐熱性、潤滑性、尺寸穩(wěn)定性、耐化學性和抗蠕變性,可用于惡劣和 的環(huán)境條件。
與大多數(shù)塑料不同,即使在高溫下也不會產生明顯的釋氣,這使得它可用于輕質隔熱罩和坩堝支撐。它在真空應用中也表現(xiàn)良好,低至極低的低溫。然而,Vespel 往往會吸收少量的水,從而導致放置在真空中的泵時間更長。
盡管在這些特性中,有些聚合物都超過了聚酰亞胺,但它們的結合是 Vespel 的主要優(yōu)勢。
熱物理性質
Vespel 通常用作測試熱絕緣體的導熱性參考材料,因為它具有高再現(xiàn)性和熱物理性能的一致性。例如,它可以承受高達 300 °C 的反復加熱,而不會改變其熱性能和機械性能。已經發(fā)布了大量測量的熱擴散率、比熱容和推導密度的表格,這些表格都是溫度的函數(shù)。
磁性
Vespel 用于 NMR 波譜的高分辨率探針,因為它的體積磁化率(Vespel SP-1 在 21.8 °C 時為 -9.02 ± 0.25×10?6[5])接近室溫下的水(20 °C 時為 -9.03×10?6 [6]) 負值表示兩種物質都是抗磁性的.將NMR樣品周圍材料的體積磁化率與溶劑的體積磁化率相匹配,可以減少磁共振線的磁化率展寬。
制造應用加工
Vespel 可以通過直接成型 (DF) 和等靜壓成型(基本形狀 - 板材、棒材和管材)進行加工。對于原型數(shù)量,通常使用基本形狀以提高成本效益,因為 DF 零件的工具成本相當高。對于大規(guī)模的CNC生產,DF零件通常用于降低每個零件的成本,而犧牲的材料性能不如等靜壓生產的基本形狀。
類型
對于不同的應用,特殊配方被混合/復合。形狀由三個標準過程生成:
壓縮成型(用于板材和環(huán));
等靜壓成型(棒材用);和
直接成型(用于大批量生產的小尺寸零件)。
與從壓縮成型或等靜壓形狀加工而成的零件相比,直接成型零件的性能特征較低。等靜壓形狀具有各向同性的物理性質,而直接成型和壓縮成型的形狀表現(xiàn)出各向異性的物理性質。
Vespel is the trademark of a range of durable high-performance polyimide-based plastics made by DuPont.[1][2]
Characteristics and applications
[edit]
Vespel is mostly used in aerospace, semiconductor, and transportation technology. It combines heat resistance, lubricity, dimensional stability, chemical resistance, and creep resistance, and can be used in hostile and extreme environmental conditions.
Unlike most plastics,[3] it does not produce significant outgassing even at high temperatures, which makes it useful for lightweight heat shields and crucible support. It also performs well in vacuum applications,[4] down to extremely low cryogenic temperatures. However, Vespel tends to absorb a small amount of water, resulting in longer pump time while placed in a vacuum.
Although there are polymers surpassing polyimide in each of these properties, the combination of them is the main advantage of Vespel.
Thermophysical properties
[edit]
Vespel is commonly used as a thermal conductivity reference material for testing thermal insulators, because of high reproducibility and consistency of its thermophysical properties. For example, it can withstand repeated heating up to 300 °C without altering its thermal and mechanical properties.[citation needed] Extensive tables of measured thermal diffusivity, specific heat capacity, and derived density, all as functions of temperature, have been published.[citation needed]
Magnetic properties
[edit]
Vespel is used in high-resolution probes for NMR spectroscopy because its volume magnetic susceptibility (?9.02 ± 0.25×10?6 for Vespel SP-1 at 21.8 °C[5]) is close to that of water at room temperature (?9.03×10?6 at 20 °C [6]) Negative values indicate that both substances are diamagnetic. Matching volume magnetic susceptibilities of materials surrounding NMR sample to that of the solvent can reduce susceptibility broadening of magnetic resonance lines.
Processing for manufacturing applications
[edit]
Vespel can be processed by direct forming (DF) and isostatic molding (basic shapes – plates, rods and tubes). For prototype quantities, basic shapes are typically used for cost efficiency since tooling is quite expensive for DF parts. For large scale CNC production, DF parts are often used to reduce per part costs, at the expense of material properties which are inferior to those of isostatically produced basic shapes.[7]
Types
[edit]
For different applications, special formulations are blended/compounded. Shapes are produced by three standard processes:
compression molding (for plates and rings);
isostatic molding (for rods); and
direct forming (for small size parts produced in large volumes).
Direct-formed parts have lower performance characteristics than parts that have been machined from compression-molded or isostatic shapes. Isostatic shapes have isotropic physical properties, whereas direct formed and compression molded shapes exhibit anisotropic physical properties.
Some examples of standard polyimide compounds are:
SP-1 virgin polyimideprovides operating temperatures from cryogenic to 300 °C (570 °F), high plasma resistance, as well as a UL rating for minimal electrical and thermal conductivity. This is the unfilled base polyimide resin. It also provides high physical strength and maximal elongation, and the best electrical and thermal insulation values. Example: Vespel SP-1.15% graphite by weight, SP-21added to the base resin for increased wear resistance and reduced friction in applications such as plain bearings, thrust washers, seal rings, slide blocks and other wear applications. This compound has the best mechanical properties of the graphite-filled grades, but lower than the virgin grade. Example: Vespel SP-21.40% graphite by weight, SP-22for enhanced wear resistance, lower friction, improved dimensional stability (low coefficient of thermal expansion), and stability against oxidation. Example: Vespel SP-22.10% PTFE and 15% graphite by weight, SP-211added to the base resin for the lowest coefficient of friction over a wide range of operating conditions. It also has excellent wear resistance up to 149 °C (300 °F). Typical applications include sliding or linear bearings as well as many wear and friction uses listed above. Example: Vespel SP-211.15% moly-filled (molybdenum disulfide solid lubricant), SP-3for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications include seals, plain bearings, gears, and other wear surfaces in outer space, ultra-high vacuum or dry gas applications. Example: Vespel SP-3.
Material properties data
[edit]
Material properties of Vespel[8] (produced by isostatic molding and machining)
Property Units Test
condition SP-1
(unfilled) SP-21
(15% graphite) SP-22
(40% graphite) SP-211
(10% PTFE,
15% graphite) SP-3
(15% MoS
2)
Specific gravity dimensionless 1.43 1.51 1.65 1.55 1.60
Thermal expansion
coefficient 10?6/K 211–296 K 45 34 27 [9]
296–573 K 54 49 38 54 52
Thermal conductivity W/mK at 313 K 0.35 0.87 1.73 0.76 0.47
Volume resistivity Ω·m at 296 K 1014–1015 1012–1013
Dielectric constant dimensionless at 100 Hz 3.62 13.53
at 10 kHz 3.64 13.28
at 1 MHz 3.55 13.58
性能優(yōu)勢
飛機發(fā)動機外件
杜邦™ Vespel® 可以幫助解決飛機發(fā)動機外部部件的嚴苛密封、磨損、摩擦、振動和耐熱性挑戰(zhàn)。
Vespel® 飛機發(fā)動機風扇葉片材料
杜邦™ Vespel® 為飛機風扇葉片耐磨條和葉片墊片提供經過驗證的強度、耐磨性和低摩擦。
發(fā)動機部件
杜邦™ Vespel® 零件在高溫下具有持久的性能,摩擦和磨損小,是襯套、墊圈和密封圈的理想選擇。
渦輪增壓器
杜邦™ Vespel® 部件有助于減少排放,同時具有耐熱性和隔熱性,是渦輪增壓器和 EGR 系統(tǒng)的理想選擇。
半導體制造后端
尺寸穩(wěn)定的杜邦™ Vespel® 部件是晶圓處理和芯片測試的理想選擇 - 它們磨損低,不會損壞金屬或陶瓷等晶圓。
飛機發(fā)動機短艙設計
杜邦™ Vespel® 具有久經考驗的剪切強度、抗沖擊性和減輕重量,可提高飛機發(fā)動機短艙的性能。
Vespel® 發(fā)動機機油系統(tǒng)密封件
杜邦™ Kalrez® O 形圈、墊圈和定制密封件可承受噴氣燃料、發(fā)動機潤滑油、液壓油、火箭推進劑和氧化劑的侵蝕。
動力運動車輛
杜邦™ Vespel® 離合器組件具有韌性、高摩擦下的低磨損和抗沖擊性,使其成為全地形車、摩托車等的理想選擇。
飛機發(fā)動機短艙設計
杜邦™ Vespel® 具有久經考驗的剪切強度、抗沖擊性、輕量化和高耐熱性,可提高飛機發(fā)動機短艙性能。
傳動系統(tǒng)組件
高性能 Vespel® 傳動系統(tǒng)組件有助于控制摩擦、限制磨損并降低卡死風險
50 多年來，飛機制造商和供應商一直依賴 Vespel® 零件和形狀、聚合物復合材料和樹脂復合材料。而且，我們的技術人員擁有 100 多個牌號，將幫助您找到應對壓縮機設計挑戰(zhàn)的 解決方案。
可靠的 Vespel® 組件可抵抗渦輪增壓器和 EGR 系統(tǒng)的高溫，并有助于減少排放
杜邦™ Vespel® 材料具有耐熱和隔熱能力，為工程師在設計汽車渦輪增壓器和 EGR（廢氣再循環(huán)）系統(tǒng)時提供了更多選擇。
提高燃油效率和減少排放的一種方法是使用渦輪增壓器和 EGR 技術。然而，在渦輪增壓環(huán)境中，組件必須能夠承受極高的溫度。即使在最苛刻的發(fā)動機條件下，包括高達 300°C（甚至在短期內甚至更高的溫度），Vespel® 襯套和墊圈也不會熔化。
即使在廢氣和碳顆粒產生油的 EGR 環(huán)境中，Vespel® 也能提供高性能、低摩擦和低磨損。
Vespel® 為發(fā)動機設計人員提供了更大的靈活性，因為它提供：
? 低磨損和低摩擦
? 低熱膨脹
? 與金屬
相比，NVH 性能更高 ? 抗沖擊和抗蠕變性
? 的尺寸穩(wěn)定性
? 耐化學性
? 渦輪機體和執(zhí)行器之間的隔熱性
